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Modification Technology
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Surface
Modification Technology (SMT)
Surface Modification Technology is utilized to minimize changes to physical and/or chemical structure of material surfaces.
TMPI
has over 18 years experience in the development and application of SMT,
and has successfully processed several million parts in a wide variety
of materials.
TMPI uses the Science and Technology of SMT to
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Minimize the quantity of base
material removed, thereby increasing the part's service life through controlled
reactions and etching rates
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Selectively remove unwanted
materials, i.e.: removing one specific compound from a combination of compounds;
deposits from semiconductor equipment used in PVD and CVD processing; cutting
oils and grease from machined components; dust and other particulate material
from critical surfaces
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Develop alternative strategies
to remove deposits that are extremely resistant to chemical and/or mechanical
processes
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Recover precious metals
from thin film deposits
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Change surface texture; enhance
adhesion of deposits during semiconductor processing
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Alter interfacial behavior and
wetting properties:
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Static and dynamic contact angles
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Surface free energy
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Flow dynamics--moving contact
line and coating flows
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Improve aesthetics: ensure surfaces
have uniform finish and appearance and are devoid of water spots and stains
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