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Surface Modification Technology (SMT)

Surface Modification Technology is utilized to minimize changes to physical and/or chemical structure of material surfaces. TMPI has over 18 years experience in the development and application of SMT, and has successfully processed several million parts in a wide variety of materials.

At TMPI, solution process tanks are large enough to handle large and odd-sized components or assemblies.  Pictured is one of the overhead cranes over a hot DI water rinse contained within a Class 1000 clean room.

TMPI uses the Science and Technology of SMT to

  • Minimize the quantity of base material removed, thereby increasing the part's service life through controlled reactions and etching rates
  • Selectively remove unwanted materials, i.e.: removing one specific compound from a combination of compounds; deposits from semiconductor equipment used in PVD and CVD processing; cutting oils and grease from machined components; dust and other particulate material from critical surfaces
  • Develop alternative strategies to remove deposits that are extremely resistant to chemical and/or mechanical processes
  • Recover precious metals from thin film deposits
  • Change surface texture; enhance adhesion of deposits during semiconductor processing
  • Alter interfacial behavior and wetting properties: 
    1. Static and dynamic contact angles
    2. Surface free energy
    3. Flow dynamics--moving contact line and coating flows
  • Improve aesthetics: ensure surfaces have uniform finish and appearance and are devoid of water spots and stains

TMPI
3118 Depot Road; Hayward CA   94545
Phone:  510-786-0680     Fax:  510-786-0178
e-mail: info@tmpi-quickclean.com
 

Copyright © 1999 TMPI, Inc. All rights reserved.